Semiconductors
10 advanced chip packaging experts
These ten professionals have held engineering and leadership roles in advanced semiconductor packaging, including 2.5D, 3D, fan-out and chiplet integration work. A reader can learn how advanced packaging technologies are developed and how the teams behind them work.
Professionals to explore
01—10Eric Kuo
LinkedInExperience: Advanced Packaging Technical Project Program Manager · Intel
Former Advanced Packaging Technical Project Program Manager at Intel (2024–2026) and Sr. Director Chiplets FCBGA Integration at Amkor Technology, Inc. (2026). The profile describes a specialization in heterogeneous advanced semiconductor packaging, including chiplet and FCBGA integration. Former IC Substrate Technical Supplier Lead Integration at Intel (2020–2024).
Jaspreet Gandhi
LinkedInExperience: Tech Lead- Advanced Packaging · Meta
Former Tech Lead- Advanced Packaging at Meta (2022–2026) and Principal Engineer-Advanced Packaging at AMD (2015–2020). The profile says the person developed advanced packaging architecture and process technologies in 3D TSV HMC/HBM/Wide IO, 2.5D SSIT, Fan Out and other formats from concept to HVM. IC Packaging Technologist at Astera Labs since 2026.
Jong-Sik Paek
LinkedInExperience: Sr. Director - Advanced packaging technology development · Amkor Technology, Inc.
Former Sr. Director - Advanced packaging technology development at Amkor Technology, Inc. (1998–2018). The profile says that since 2023 at Intel the person has led an advanced packaging development team in Taiwan and Germany, covering project management for 3D chip on wafer and heterogeneous integration of chiplets, package design and simulation. Former Senior Member of Technical Staff at Micron Technology (2018–2023).
Kathy Yan
LinkedInExperience: Director, Advanced Packaging Technology, System Integration & Program · TSMC
Director, Advanced Packaging Technology, System Integration & Program at TSMC since 2020. Former Second level R&D Process Development Engineering Manager at Intel (2013–2017), Underfill mold module group leader at Intel (2007–2013) and Senior Engineer Manager at Medtronic (2017–2020).
Max Wu
LinkedInExperience: Advanced Packaging 2.5D 3D Platform Management - Technical Director · Intel
Advanced Packaging 2.5D 3D Platform Management - Technical Director at Intel since 2021, a role the profile tags at director level. Former Packaging Process Integration, Program Manager at TSMC (2007–2021) and Communication Product Packaging, Sr. Engr. at Infineon Technologies (2004–2007).
Nikhil Ganesh
LinkedInExperience: Engineering Area Manager - Advanced semiconductor packaging · Intel
Engineering Area Manager - Advanced semiconductor packaging at Intel since 2021; the profile headline gives the role as Wafer Level Assembly Area Manager. The profile also lists Engineering Manager at Intel for 2012–2019 and for 2019–2021, and Lithography Engineer Staff Engineer at Intel (2009–2012).
Pooya Tadayon
LinkedInExperience: Vice President & Sr. Fellow, Advanced Packaging, GF Labs · GlobalFoundries
Vice President & Sr. Fellow, Advanced Packaging, GF Labs at GlobalFoundries since 2026. Former VP of Packaging, Test, & Platform Engineering at Ayar Labs (2024–2025), reporting to the CEO as a member of the executive leadership team, and Intel Fellow & Director of Assembly & Test Pathfinding at Intel (2018–2024).
Raja Swaminathan
LinkedInExperience: Corporate Vice President · AMD
Corporate Vice President at AMD since 2022. The profile says the person leads advanced packaging, optics and system integration at AMD across client, gaming and datacenter products, and was named an IEEE Fellow in 2025 for leadership in chiplet architectures through advanced packaging. Former Senior Fellow at AMD (2020–2022) and Principal Engineer, Silicon Package Architect at Intel (2005–2018).
Srikanth Gunti
LinkedInExperience: Advance Semiconductor Packaging 2.5D 3D Product Packaging Engineering Manager · Intel
Advance Semiconductor Packaging 2.5D 3D Product Packaging Engineering Manager at Intel since 2025. Former Packaging R&D Engineer - CMP (2022–2025) and PTD CMP Eng (2018–2022) at Intel, and Snr Engineer Process Engineering - Etch at GlobalFoundries (2017–2018).
Teck Chong Lee
LinkedInExperience: Technical Director · ASE Global
Technical Director at ASE Global since 2021; the profile gives the role as Advanced Fanout Development, Technical Director at Corp. R&D, ASE Group, and lists advanced fanout development for HPC applications and RDL interposer qualification for HBM3/3E. Former Senior Technical Manager at ASE Global (2018–2021).
Choose the right perspective
Match the person's seat to your question, since packaging work at a chip designer, a foundry and an assembly and test house sees different tradeoffs. Also consider whether you need someone close to process and integration engineering or someone who has led packaging strategy and architecture.
Questions to take into the conversation
- 01How do you decide between 2.5D, 3D and fan-out packaging for a given product, and what tradeoffs matter most?
- 02What are the hardest yield, thermal and reliability problems you have faced when integrating chiplets or HBM?
- 03How do you work with foundries, substrate suppliers and assembly partners to qualify a new advanced package?
Reaching advanced chip packaging experts
How can I contact one of these advanced chip packaging experts?
Pick one of the 10 people on this page and choose "Book a paid call", or describe your project to find others. You offer a fee for a 15-minute call or a written answer, Instant Expert finds the person's work email and sends the invitation, and they decide whether to accept. The list covers 7 companies, including Intel; Meta and Amkor Technology, Inc., based on profile data retrieved on October 3, 2026. Being listed here doesn't mean someone has agreed to take calls.
How much does it cost to reach advanced chip packaging experts?
You choose the offer, starting at $5 per person. It includes Instant Expert's 20% fee, so an offer that pays the person $100 costs you $125. You're charged only when the person books the call or sends the answer.
What if they don't reply?
You pay nothing. Instant Expert sends follow-up reminders, and if the person hasn't booked or answered within 7 days, the request expires and any hold on your card is released. You can invite several of the 10 people on this list at once and cap your total spend, so you pay only for the ones who accept.
About this directory
This is a professional research starting point based on business profile data retrieved on . Titles and companies reflect that source snapshot and may describe past or present roles. Check the linked profiles for current details. Inclusion does not imply Instant Expert membership or availability.
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