10 Amkor Technology engineering leaders
Whye Keong Ho, Engineering Senior Director at Amkor Technology, is one of ten Amkor Technology engineering leaders listed here, alongside people who hold or have held packaging engineering, process engineering and R&D director roles at the company. A reader can learn how engineering leaders work at Amkor Technology from people who have held the role.
Professionals to explore
August Miller
LinkedInExperience: Director, R&D Design Center at Amkor Technology · Amkor Technology, Inc.
August Miller has been Director, R&D Design Center at Amkor Technology at Amkor Technology, Inc. since March 2017, based in Tempe, Arizona, and also lists Sr. Design Manager there as a current role from 2000. August Miller was Corporate Quality Manager at Bay Technical Associates, BayTech in 2005.
DooHyun Park
LinkedInExperience: Sr. Director, R&D, Technology Head Quaters · Amkor Technology, Inc.
DooHyun Park has been Sr. Director, R&D, Technology Head Quaters at Amkor Technology, Inc. since September 1994, based in South Korea, and the profile headline places the role in TSV development. The profile lists semiconductor package R&D, package design and technology R&D strategy and roadmap among specialties, along with TSV assembly and wafer processing.
HoJeong Lim
LinkedInExperience: Director of IC Packaging Design · Amkor Technology, Inc.
HoJeong Lim has been Director of IC Packaging Design at Amkor Technology, Inc. since April 2016, based in San Diego, and was Director of IC Packaging Integration/Design & Simulation there from 2004 to 2016. The profile lists Qualcomm interface work in the current role, and HoJeong Lim was Sr. Engineer at GlobalFoundries from 2003 to 2004.
John Joseph Magno
LinkedInExperience: Engineering Director · Amkor Technology, Inc.
John Joseph Magno has been Engineering Director at Amkor Technology, Inc. since August 2016, based in Metro Manila, and also lists an engineering manager role for automotive MEMS and military products at Amkor technology philippines from 2005. John Joseph Magno was Process Engineering manager at Texas instruments Philippines from 2003 to 2005.
Keven Chen
LinkedInExperience: Director of Semiconductor Process Engineering · Amkor Technology, Inc.
Keven Chen was Director of Semiconductor Process Engineering at Amkor Technology, Inc. from February 2019 to January 2023 and Senior Manager, Wafer Fab Operations there from 2012 to 2019. Keven Chen was Principal Process Engineer at SkyWater Technology from 2007 to 2012, and the profile cites process optimization, yield improvement and technology transfer.
Leonardo Viñalon
LinkedInExperience: Director of Process Engineering · Amkor Technology, Inc.
Leonardo Viñalon has been Director of Process Engineering at Amkor Technology, Inc. since November 2025, with the role located in Laguna, Philippines, and was Quality Senior Manager there from 2022 to 2025. Leonardo Viñalon was Process Engineering Manager at Amkor Technology, Inc. from 2021 to 2022 and Quality Engineering Manager there from 2019 to 2021.
Rick Reed
LinkedInExperience: Director - Advanced Packaging Technology Integration · Amkor Technology, Inc.
Rick Reed has been Director - Advanced Packaging Technology Integration at Amkor Technology, Inc. since January 2005, based in Raleigh, North Carolina, and the profile headline points to advanced 3D products and technologies. Rick Reed was Manufacturing Manager at Ziptronix, Inc. from 2000 to 2004 and Sr. Scientist at RTI International from 1995 to 2000.
Whye Keong Ho
LinkedInExperience: Engineering Senior Director · Amkor Technology, Inc.
Whye Keong Ho has been Engineering Senior Director at Amkor Technology, Inc. since January 2024, based in Selangor, Malaysia, and was Operation Director there from 2020 to 2024. Whye Keong Ho was Manufacturing Department Manager at Amkor Technology, Inc. from 2013 to 2020 and Senior Production Manager at Toshiba Corporation from 2008 to 2013.
Youngdo Kweon
LinkedInExperience: Senior Director, Chiplets FCBGA development · Amkor Technology, Inc.
Youngdo Kweon has been Senior Director, Chiplets FCBGA development at Amkor Technology, Inc. since June 2015, based in Chandler, Arizona. Youngdo Kweon was Vice President R&D at Samsung Electro-Mechanics from 2011 to 2015 and a group leader at the senior director level there from 2006 to 2011.
YS Low
LinkedInExperience: FCBGA BU Director · Amkor Technology, Inc.
YS Low has been FCBGA BU Director at Amkor Technology, Inc. since July 2018, based in Tempe, Arizona, and the profile describes managing semiconductor packaging development and outsourced manufacturing. YS Low was Flip Chip Director at ASAT from 2003 to 2006, also lists engineering manager roles at AMD, and cites 2.5D package development and reliability qualification.
Choose the right perspective
Match the person's area, such as package design, process engineering, advanced packaging R&D or a factory engineering team, to the decision you face. Pick someone whose package type or country is closest to your question.
Questions to take into the conversation
- 01What did you change first when you took on your engineering leadership role, and why?
- 02How do you work with a customer's design team when a new package moves from development into production?
- 03What has your own work taught you about qualifying a new package for volume manufacturing?
Reaching Amkor Technology engineering leaders
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About this directory
This is a professional research starting point based on business profile data retrieved on . Titles and companies reflect that source snapshot; roles marked former had ended by then. Check the linked profiles for current details. Inclusion does not imply Instant Expert membership or availability.
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