Engineering professionals in Semiconductors
Etch, deposition, yield and technology transfer run through these semiconductor engineering careers. Intel appears in five of them, alongside current or recent roles at Micron Technology, Lam Research, Applied Materials, GlobalFoundries, Qorvo, NXP Semiconductors, SSMC and Black Semiconductor. Fab teams fighting yield loss, planning a transfer into high-volume manufacturing or choosing deposition and etch equipment can find a matching title.
Professionals to explore
Anil Prakasam
LinkedInExperience: Director of Process Engineering · Micron Technology
Dry etch, wet process and CMP are the areas Anil Prakasam describes covering as Director of Process Engineering at Micron Technology since 2024. Intel titles include Dry Etch Department Manager (2022–2024), Director of Dry Etch Technology Development (2021–2023), Dry Etch Area Manager (2019–2023) and Engineering Manager (2015–2019), and Anil describes designing FE Gate and BE Interconnect materials and process flow, a fit for etch and integration questions.
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Deepak Aravamudhan
LinkedInExperience: Former Director Technology transfer and Integration Engineering · GlobalFoundries
Deepak Aravamudhan has been Senior Director Operations at Black Semiconductor since 2026. GlobalFoundries titles were Director Technology transfer and Integration Engineering (2022–2025), Director Manufacturing Expansion and Ramp management (2021–2022), Director Integration Engineering and Yield (2019–2021) and Manager Product Integration Customer Program Management (2017–2019), with nearly 20 years across the USA, Germany and Singapore, a fit for technology transfer questions.
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Deo Brat Singh
LinkedInExperience: Director of Product Engineering · Systems on Silicon Manufacturing Company Pte Ltd (SSMC)
At Systems on Silicon Manufacturing Company Pte Ltd (SSMC), Deo Brat Singh has been Director of Product Engineering since 2025 and was Director, Technology Development (2020–2025) and Deputy Director, Technology Development (2017–2020). At GlobalFoundries, Deo was Manager, Process Integration (2013–2017) and Sr Section Manager, Process Integration (2011–2013), and names NPI, yield improvement and technology transfer as focus areas.
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Ganesan Radhakrishnan
LinkedInExperience: Director Of Process Engineering · Qorvo, Inc.
Since 2016 Ganesan Radhakrishnan has been Director Of Process Engineering at Qorvo, Inc., responsible for BAW Filter process technologies. At Intel, Ganesan was Director of Yield and CMOS Integration- Logic Technologies Ramp (2005–2016), Senior Yield Engineering Manager, Intel Fab20 in Oregon (2002–2005) and 22nm Process Technology Transfer Program Manager (2000–2002), so yield ramp questions fit well.
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Jose Valdez
LinkedInExperience: Director Engineering Etch and Lithpgraphy · Black Semiconductor
Taking processes from startup through ramp into high volume manufacturing is the arc Jose Valdez describes. Director Engineering Etch and Lithpgraphy at Black Semiconductor since 2025, Jose was Silicon Development Engineer Member of Technical Staff (2024–2025) and Silicon Development Engineering Manager (2023–2024) at onsemi, and Process Development Director (2017–2022) and Senior Technology Transfer Engineer of Manufacturing (2014–2017) at Крокус Наноэлектроника / Crocus Nano Electronics.
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Patrick Van Cleemput
LinkedInExperience: Sr. Director of Engineering ATD · Lam Research
Semiconductor capital equipment is the setting Patrick Van Cleemput describes, taking products from concept and feasibility through alpha and beta to full customer deployment. At Lam Research, Patrick has been Sr. Director of Engineering ATD since 2021 and was Sr. Dir ALD CVD Metals C&F Direct Metals BU (2018–2021) and Director of Engineering DPG Advanced Gap Fill (2014–2018), and held VP of Engineering (2013–2014) and Sr. Director of Engineering (2012–2013) titles at Scifiniti (formerly iPV).
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Sanjeev Baluja
LinkedInExperience: Head of Engineering, MDP and ALD Business Units · Applied Materials
Metal Deposition and Atomic Layer Deposition Business Units are what MDP and ALD stand for in Sanjeev Baluja's title, Head of Engineering, MDP and ALD Business Units at Applied Materials since 2025. Other Applied Materials titles are Senior Director of Engineering (2016–2021), Engineering Director (2013–2015), Engineering Manager (2008–2012) and Lead Design Engineer (2006–2007), with over 20 years on ALD, PEALD, CVD and PECVD product teams, a fit for deposition equipment questions.
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Sean Dunnigan
LinkedInExperience: Engineering Manager · NXP Semiconductors
Sean Dunnigan has been Engineering Manager at NXP Semiconductors since 2022 and held Research and Development Program Manager at Rogers Corporation (2019–2022), Director Of Engineering at FlipChip International (2018–2019) and Engineering Manager titles at Cree (2017–2018) and Intel (1995–2017). Sean names R&D to production, high-volume factory ramp and yield and cost work, which suits factory ramp questions.
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Venkata Vasiraju
LinkedInExperience: Director of Engineering - North America Europe · EMD Electronics
Manufacturing scale-up is the focus Venkata Vasiraju names as Director of Engineering - North America Europe at EMD Electronics since 2025. Venkata was also Sr. Manager, Process Engineering at Form Energy (2025), and at Intel held WATD Engineering Manager (2023–2025), LTD Etch Ash Engineering Manager (2022–2023) and Individual Contributor (2020–2022) roles, a fit for questions on etch and ash process engineering and manufacturing scale-up.
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Choose the right perspective
For etch, Anil Prakasam, Jose Valdez and Venkata Vasiraju hold the closest titles, and deposition questions suit Sanjeev Baluja and Patrick Van Cleemput at Applied Materials and Lam Research. Yield and technology transfer questions fit Deo Brat Singh, Ganesan Radhakrishnan, Deepak Aravamudhan and Sharath Hegde, while Sean Dunnigan covers moving from R&D into a high-volume factory ramp.
Questions to take into the conversation
- 01When yield drops after a process change, how do you separate a tool problem from an integration problem?
- 02What makes a technology transfer from development into high-volume manufacturing slip, and how do you catch it early?
- 03How do you weigh a new deposition or etch tool's cost of ownership against the yield gain it promises?
About this directory
This is a professional research starting point based on business profile data retrieved on . Titles and companies reflect that source snapshot; roles marked former had ended by then. Check the linked profiles for current details. Inclusion does not imply Instant Expert membership or availability.